Our Products

LASER BLENDER Ryujin & Raijin

This system is a next-generation laser ablation system that realizes high-speed and high-precision elemental analysis.

It can perform “imaging” and “depth” analysis at the targeted location on the sample by direct approach to the individual sample, which not only simplifies the preprocessing of ICP analysis but also expands the range of analytical methods.

Laser Scriber Machine

This equipment is designed for scribing electronic component substrates using a laser beam.
Please feel free to contact us for a free sample processing.

Stealth Dicing Machine

This system is equipped with a stealth dicing engine (Hamamatsu Photonics’ patented technology), which makes it possible to cut transparent materials, which until now has been considered difficult to process with precision and high accuracy.

Please feel free to contact us for a free sample processing.

Versatile laser processing equipment

We select a laser oscillator that meets your requirements and support a variety of laser processing applications!

Loader/Unloader (various development equipment)

Automatically supplies and stores workpieces to processing equipment, inspection equipment, etc.
Just by pressing the start button once, the system automatically performs everything from feeding to storing, thereby increasing work efficiency and reducing manpower at the work site.

X-ray inspection equipment (various development equipment)

Equipment that takes 360-degree X-ray images (radiography) of an object and inspects its internal state without destroying it

Chip aligner

Automatically transfers and aligns 0.5 mm chips.
Only the specified side of the chip is detected during pick-up.
After pickup, position correction, accuracy correction, color identification, and target chip search are performed.
The chips are then aligned at equal pitch intervals.