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Laser Scriber Machine
This equipment is designed for scribing electronic component substrates using a laser beam.
Please feel free to contact us for a free sample processing. -
Stealth Dicing Machine
This system is equipped with a stealth dicing engine (Hamamatsu Photonics’ patented technology), which makes it possible to cut transparent materials, which until now has been considered difficult to process with precision and high accuracy.
Please feel free to contact us for a free sample processing. -
Versatile laser processing equipment
We select a laser oscillator that meets your requirements and support a variety of laser processing applications!
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Laser Lift-off Machine
This equipment is a processing system that uses a laser beam to peel off only the device layer by ablating the interface between the device and the glass or transparent substrate by irradiating the laser beam from the back side of the device stacked on the glass or transparent substrate.
