Laser Lift-off Machine

  • Precision Equipment
  • Laser Processing Equipment

Equipped with a galvano mirror, enabling curved laser processing

This equipment is a processing system that uses a laser beam to peel off only the device layer by ablating the interface between the device and the glass or transparent substrate by irradiating the laser beam from the back side of the device stacked on the glass or transparent substrate.

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Target Substrate Materials

  • Glass
  • Sapphire
  • SiC
  • GaN

General Specifications

Inquiry for details

Please contact the following person for detailed equipment specifications, functions, and sample processing requests.

Sales Department 2, Kobe Head Office