What is Laser Lift-Off (LLO)?
Laser Lift-Off is an advanced laser processing technology used to separate device layers from glass or transparent substrates. By directing a laser beam from the rear side of the device, the system ablates the interface between the device and the substrate, allowing only the device layer to be cleanly peeled away. Equipped with a galvano mirror, this equipment also enables precise curved laser processing, making it ideal for materials such as glass, sapphire, SiC, and GaN. Laser Lift-Off technology is essential for applications requiring high precision and efficiency in device separation processes.
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Target Substrate Materials
- Glass
- Sapphire
- SiC
- GaN
General Specifications
| Wavelength | IR/SHG/THG/FHG |
|---|---|
| Pulse Width | Nanosecond, Picosecond, Femtosecond |
| Optical System | Fixed optical system or Galvano-optical system |
| XY Stage | 500 mm × 500 mm |
| Processing Range | 160 mm |
| Movement Speed | Max 1,000 mm/sec |
| Repeatability | ±1 μm or less |
| Absolute Position Accuracy: | ±5 μm or less |
| Wafer Size | 2–6 inches |
| Control | Windows 10 and PLC |
| Power Supply Voltage | AC 200 V ±20 V, Single-phase, 50/60 kHz |
| External Dimensions | 2400 mm (W) × 1700 mm (D) × 2000 mm (H) |
| Weight | 1,000 kg |