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High Precision Bond Tester (Model:SS-30WD)
This model is designed to make a high precision bond strength testing such as wire pull testing, die
shear testing, peel testing, etc.
Variety of testing can be measured by one load cell unit.
[Features]
- Testing image can be saved into PC by using CCD vision system.
- SS-30WD has an RS232C interface to provide testing result data.
- High precision micro-step motor allows reliable testing.
- Heating stage is available by option.
Operations
Shear Test
- Bonding strength of die-chip
- Bonding strength of solder ball
- Bonding strength of passive components
- Shear test on the heating stage
Pull Test
- Wire bonding strength
- Lead pull test for QFP, TSOP, etc.
- Bonding strength of Land pad
Peel Test
- Peeling strength of carrier tape
- Peeling strength of adhesive tape, ACF, etc.
Push Test
- Passive components
- Silicon wafer, etc.
Specifications
| Load cell accuracy | ±0.1%FS |
|---|---|
| Maximum measure value | 50kg |
| Stage traveling distance | X axis : 100mm Z axis : 100mm |
| Work stage resolution | 1μm |
| Measure speed | 6μm/sec～1mm/sec |
| Dimensions | 485mm×435mm×565mm (Wm×Lm×H) |
| Weight | 75kg |
| Power supply | AC100V, 1A, 50Hz/60Hz, 1phase |
